Product scope covers all types, technologies, applications

Product scope covers all types, technologies, applications
China LCD module makers’ product portfolio encompasses all types, interfaces and packaging of standard or customized models for the low-end, midrange and high-end markets. Makers offer dot-matrix, alphanumeric, segmented and graphics LCD modules employing TN, HTN, STN, FSTN, CSTN and TFT technologies and packaged in COG, COF, TAB and COB.
TN/STN-LCD modules are usually for entry-level finished products, including those with irregularly shaped form factors such as novelty calculators, clocks and watches. However, because of the limited applications and high technology threshold, not many China suppliers mass-produce customized models. TN/STN-LCD modules for novelty products entail a degree of customization. In some cases, makers use silkscreen or specialized printing methods.
CSTN and TFT-LCD modules are primarily for upmarket applications. These modules usually come in standard models, as the higher production overhead compared with that for TN/STN types limits makers’ customization activities.
Suppliers are cutting down their output of CSTN LCD modules in response to declining demand. As for TFT-LCD modules, makers have no immediate major production expansion plans although the popularity of TFT-LCD modules as an alternative for CSTN types continues to rise. This is largely because of the uptrend in storage and raw material costs, especially TFT panels and ICs.
Most China companies focus on TN/STN/CSTN products for communication, consumer electronics, in-car and office automation applications. More TN/STN- or TFT-LCD modules are now also being used in new-generation consumer electronic products. Suppliers forecast low-end TN/STN-LCD modules with black and white display in standard models will continue to dominate production in the coming years. However, a marked increase in demand for high-end static graphic displays will compel more companies to produce more of these products. Moreover, makers are increasingly espousing COG technique, which is less costly than COB. The COG process of IC bonding facilitates integration into end products with very small form factors.